Invention Grant
- Patent Title: Multi-layer wire structure for high efficiency wireless communication
- Patent Title (中): 多层线结构，高效无线通信
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Application No.: US13233751Application Date: 2011-09-15
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Publication No.: US09439287B2Publication Date: 2016-09-06
- Inventor: Vinit Singh , Christine A. Frysz
- Applicant: Vinit Singh , Christine A. Frysz
- Applicant Address: US IL Chicago
- Assignee: NuCurrent, Inc.
- Current Assignee: NuCurrent, Inc.
- Current Assignee Address: US IL Chicago
- Agency: McDermott Will & Emery, LLP
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H05K1/16 ; H05K3/46
Abstract:
A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency.
Public/Granted literature
- US20130068507A1 Multi-Layer Wire Structure for High Efficiency Wireless Communication Public/Granted day:2013-03-21
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