Invention Grant
- Patent Title: Device mounting board and semiconductor power module
- Patent Title (中): 器件安装板和半导体电源模块
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Application No.: US14092054Application Date: 2013-11-27
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Publication No.: US09439285B2Publication Date: 2016-09-06
- Inventor: Keishi Kato , Osamu Tabata , Yoshio Okayama , Ryosuke Usui
- Applicant: SANYO ELECTRIC CO., LTD.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2011-167774 20110729
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H05K1/05 ; H01L23/14 ; H01L23/13 ; H01L23/00 ; H01L25/07 ; H05K1/02

Abstract:
In the upper surface of a metallic substrate, a region near the central part of the metallic substrate is surrounded by a rectangle having dotted sides electrically separate the interior and exterior of the rectangle. Each dot of the sides is formed of a pillared insulating resin that penetrates from the upper surface to the lower surface of the metallic substrate. Oxide films are so formed as to fill in the spaces between adjacent cylinders of insulating resins and the surrounding of the cylinders. That is, a separation layer is formed of the pillared insulating resins and the oxide films that fill up the spaces between the pillared insulating resins as well as their vicinities.
Public/Granted literature
- US20140085834A1 DEVICE MOUNTING BOARD AND SEMICONDUCTOR POWER MODULE Public/Granted day:2014-03-27
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