Invention Grant
- Patent Title: Ceramic circuit board and electronic device
- Patent Title (中): 陶瓷电路板和电子设备
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Application No.: US14457429Application Date: 2014-08-12
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Publication No.: US09439279B2Publication Date: 2016-09-06
- Inventor: Makoto Tani , Yoshihiro Tanaka , Takashi Ebigase
- Applicant: NGK INSULATORS, LTD.
- Applicant Address: JP Nagoya
- Assignee: NGK Insulators, Ltd.
- Current Assignee: NGK Insulators, Ltd.
- Current Assignee Address: JP Nagoya
- Agency: Burr & Brown, PLLC
- Priority: JP2013-169261 20130816
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/02 ; H05K1/11 ; H01L23/367 ; H01L23/373 ; C04B37/02 ; H05K1/03
Abstract:
A ceramic circuit board includes a ceramic substrate, and a first metal plate bonded to a front surface of the ceramic substrate. A size of the front surface of the ceramic substrate is smaller than a size of a surface, i.e., a first facing surface, on a side of the first metal plate that faces the ceramic substrate.
Public/Granted literature
- US20150049442A1 CERAMIC CIRCUIT BOARD AND ELECTRONIC DEVICE Public/Granted day:2015-02-19
Information query
