Invention Grant
- Patent Title: Wiring module and method for assembling wiring module
- Patent Title (中): 接线模块和组装接线模块的方法
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Application No.: US14769136Application Date: 2014-02-18
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Publication No.: US09438020B2Publication Date: 2016-09-06
- Inventor: Tomohiro Shimada , Tetsuya Sonoda , Isamu Hamamoto , Yusuke Kobayashi
- Applicant: SUMITOMO WIRING SYSTEMS, LTD.
- Applicant Address: JP Mie
- Assignee: SUMITOMO WIRING SYSTEMS, LTD.
- Current Assignee: SUMITOMO WIRING SYSTEMS, LTD.
- Current Assignee Address: JP Mie
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2013-046154 20130308
- International Application: PCT/JP2014/053758 WO 20140218
- International Announcement: WO2014/136565 WO 20140912
- Main IPC: H02G3/30
- IPC: H02G3/30 ; B60R16/02 ; H02G1/06 ; H02G3/04 ; H02G3/38
Abstract:
It is aimed to improve soundproofing of a wiring module. The wiring module is provided with a sheet-shaped first soundproofing member; a wire harness which contains at least one wire and is disposed at least partially along one main surface of the first soundproofing member, and a second soundproofing member. The second soundproofing member is provided partially to one main surface of the first soundproofing member and holds the wire harness interposed between the first soundproofing member and the second soundproofing member.
Public/Granted literature
- US20150380916A1 WIRING MODULE AND METHOD FOR ASSEMBLING WIRING MODULE Public/Granted day:2015-12-31
Information query
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