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US09437839B2 Method for manufacturing electronic device and electronic device manufactured thereby 有权
由此制造电子设备和电子设备的方法

Method for manufacturing electronic device and electronic device manufactured thereby
Abstract:
On a support substrate, an adhesive layer is formed from a material which decreases an adhesion force thereof to the support substrate when absorbing moisture. In addition, a resin substrate is formed on the adhesive layer, and a sealing layer is formed which seals at least a portion of a laminate structure including the adhesive layer and the resin substrate at which the adhesive layer is exposed. An electronic element is formed above the resin substrate. After a part of a sealing structure including the sealing layer and the support substrate is removed so as to expose the adhesive layer, moisture is supplied to the adhesive layer. An electronic device including the electronic element and the resin substrate is peeled away from the support substrate.
Abstract(Chinese):

在支撑基板上，由吸收水分时的粘附力降低到支撑基板上的材料形成粘接层。 此外，在粘合剂层上形成树脂基板，形成密封层，该密封层密封包括粘合剂层和粘合剂层露出的树脂基板的层叠结构的至少一部分。 电子元件形成在树脂基板的上方。 在包括密封层和支撑基板的密封结构的一部分被去除以暴露粘合剂层之后，将水分供应到粘合剂层。 包括电子元件和树脂基板的电子设备从支撑基板剥离。

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