Invention Grant
- Patent Title: Method of manufacturing electrical device
- Patent Title (中): 电气设备制造方法
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Application No.: US14936654Application Date: 2015-11-09
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Publication No.: US09437754B2Publication Date: 2016-09-06
- Inventor: Hikaru Uno , John Donald Summers , Esther Kim
- Applicant: E I DU PONT DE NEMOURS AND COMPANY
- Applicant Address: US DE Wilmington
- Assignee: E I DU PONT DE NEMOURS AND COMPANY
- Current Assignee: E I DU PONT DE NEMOURS AND COMPANY
- Current Assignee Address: US DE Wilmington
- Main IPC: H01L31/0224
- IPC: H01L31/0224

Abstract:
A method of manufacturing an electrical device comprising steps of: preparing a substrate; applying a conductive paste onto the substrate, wherein the conductive paste comprises (i) an inorganic powder comprising at least a conductive powder, (ii) an organic polymer, (iii) a solvent and (iv) a gellant selected from the group consisting of a polyalkyleneoxy terminated polyamide (PAOPA), an ester terminated polyamide (ETPA), polyether polyamine (PEPA) and a mixture thereof; and heating the applied conductive paste to form an electrode.
Public/Granted literature
- US20160133764A1 METHOD OF MANUFACTURING ELECTRICAL DEVICE Public/Granted day:2016-05-12
Information query
IPC分类: