Invention Grant
US09437572B2 Conductive pad structure for hybrid bonding and methods of forming same
有权
用于混合键合的导电垫结构及其形成方法
- Patent Title: Conductive pad structure for hybrid bonding and methods of forming same
- Patent Title (中): 用于混合键合的导电垫结构及其形成方法
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Application No.: US14133328Application Date: 2013-12-18
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Publication No.: US09437572B2Publication Date: 2016-09-06
- Inventor: Sheng-Chau Chen , Shih Pei Chou , Yen-Chang Chu , Cheng-Hsien Chou , Chih-Hui Huang , Yeur-Luen Tu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L23/00 ; H01L21/324 ; H01L27/146 ; H01L21/311 ; H01L21/321
Abstract:
A method embodiment includes patterning an opening through a layer at a surface of a device die. The method further includes forming a liner on sidewalls of the opening, patterning the device die to extend the opening further into the device die. After patterning the device die, the liner is removed. A conductive pad is formed in the device die by filling the opening with a conductive material.
Public/Granted literature
- US20150171050A1 Conductive Pad Structure for Hybrid Bonding and Methods of Forming Same Public/Granted day:2015-06-18
Information query
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