Invention Grant
- Patent Title: Power converter package with an integrated output inductor
- Patent Title (中): 功率转换器封装，集成输出电感
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Application No.: US14538483Application Date: 2014-11-11
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Publication No.: US09437570B2Publication Date: 2016-09-06
- Inventor: Eung San Cho , Kevin Moody , Parviz Parto
- Applicant: Infineon Technologies Americas Corp.
- Applicant Address: US CA El Segundo
- Assignee: Infineon Technologies Americas Corp
- Current Assignee: Infineon Technologies Americas Corp
- Current Assignee Address: US CA El Segundo
- Agency: Shumaker & Sieffert, P.A.
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/00 ; H01L23/495 ; H02M3/155
Abstract:
In one implementation, a power semiconductor package includes a conductive carrier including a switch node segment and a power output segment. The power semiconductor package also includes an integrated output inductor stacked over the conductive carrier and configured to couple the switch node segment to the power output segment. The power semiconductor package further includes a power stage stacked over the integrated output inductor.
Public/Granted literature
- US20150162297A1 Power Converter Package with an Integrated Output Inductor Public/Granted day:2015-06-11
Information query
IPC分类:
