Power electronics modules having jet impingement assemblies utilized to cool heat generating devices are disclosed. In one embodiment, a jet impingement assembly includes coupled manifold plates having a fluid inlet and outlet, a distribution surface, and a collection surface. The distribution surface of the first and second manifold plate is coupled to define a distribution manifold having a fluid distribution channel and one or more arrays of orifices extending through both manifold plates. Heat transfer plates are coupled to each manifold plate's collection surface forming impingement chambers. The heat transfer plates include one or more arrays of fins extending toward the collection surface of each manifold plate fluidly coupled to the fluid outlet. The first and second manifold plates and the first and second heat transfer plates are positioned in a horizontal stack such that the fluid inlets of both manifold plates are adjacent.