Invention Grant
US09437514B2 Semiconductor package with coated side walls and method of manufacture
有权
具有涂层侧壁的半导体封装及其制造方法
- Patent Title: Semiconductor package with coated side walls and method of manufacture
- Patent Title (中): 具有涂层侧壁的半导体封装及其制造方法
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Application No.: US14698436Application Date: 2015-04-28
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Publication No.: US09437514B2Publication Date: 2016-09-06
- Inventor: Werner Hunziker
- Applicant: Sensirion AG
- Applicant Address: CH Stafa
- Assignee: Sensirion AG
- Current Assignee: Sensirion AG
- Current Assignee Address: CH Stafa
- Agency: Cooper & Dunham LLP
- Priority: EP14167397 20140507
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/29 ; H01L21/302 ; H01L21/56 ; B81C1/00
Abstract:
A semiconductor package including an integrated device, the package having a front side, a back side and side walls linking the front and back sides, wherein each side wall is coated, to at least 80% of its area, with a coating material different from the material(s) of the back and front sides. A method of manufacturing a semiconductor package by providing an assembly containing an array of the packages, the assembly having thickness d0 and being attached to a dicing tape of thickness dd, fabricating a set of first dicing streets with width w1 and depth d1
Public/Granted literature
- US20150325492A1 SEMICONDUCTOR PACKAGE Public/Granted day:2015-11-12
Information query
IPC分类:
