Invention Grant
- Patent Title: Inertial wafer centering end effector and transport apparatus
- Patent Title (中): 惯性晶片定心端部执行器和输送装置
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Application No.: US11741416Application Date: 2007-04-27
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Publication No.: US09437469B2Publication Date: 2016-09-06
- Inventor: Anthony V. DiBella , Dennis Poole , William Fosnight
- Applicant: Anthony V. DiBella , Dennis Poole , William Fosnight
- Applicant Address: US MA Chelmsford
- Assignee: Brooks Automation, Inc.
- Current Assignee: Brooks Automation, Inc.
- Current Assignee Address: US MA Chelmsford
- Agency: Perman & Green, LLP
- Agent Colin C. Durham
- Main IPC: H01L21/68
- IPC: H01L21/68 ; H01L21/687
Abstract:
A substrate transport apparatus for a processing tool. The apparatus has a drive section, a movable arm, and an end effector. The arm is operably connected to the drive section. The end effector is connected to the movable arm for holding and transporting the substrate in the processing tool. The apparatus has a substrate inertial capture edge grip connected to the end effector and arranged so that the grip effects capture and centering of the substrate onto the end effector from substrate inertia.
Public/Granted literature
- US20080267747A1 INERTIAL WAFER CENTERING END EFFECTOR AND TRANSPORT APPARATUS Public/Granted day:2008-10-30
Information query
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