Invention Grant
- Patent Title: Heating device
- Patent Title (中): 加热装置
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Application No.: US13863729Application Date: 2013-04-16
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Publication No.: US09437463B2Publication Date: 2016-09-06
- Inventor: Nobuyuki Kondo , Morimichi Watanabe , Asumi Jindo , Yuji Katsuda , Yosuke Sato , Yoshinori Isoda
- Applicant: NGK INSULATORS, LTD.
- Applicant Address: JP Nagoya
- Assignee: NGK Insulators, Ltd.
- Current Assignee: NGK Insulators, Ltd.
- Current Assignee Address: JP Nagoya
- Agency: Burr & Brown, PLLC
- Priority: JP2010-239000 20101025; JP2011-135312 20110617; JPPCT/JP2011/069479 20110829
- Main IPC: H05B3/68
- IPC: H05B3/68 ; H01L21/67 ; C04B35/581 ; H05B1/00 ; B32B18/00 ; H05B3/28 ; H01L21/683 ; C04B35/58 ; C04B35/626 ; C04B35/645 ; C04B37/00 ; C23C14/34
Abstract:
A heating apparatus includes a susceptor having a heating face of heating a semiconductor and a supporting part joined with a back face of the susceptor. The susceptor comprises a ceramic material comprising magnesium, aluminum, oxygen and nitrogen as main components. The material comprises a main phase comprising magnesium-aluminum oxynitride phase exhibiting an XRD peak at least in 2θ=47 to 50° by CuKα X-ray.
Public/Granted literature
- US20130220988A1 HEATING DEVICE Public/Granted day:2013-08-29
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