Aspects of the invention include a semiconductor device that enables both solder-outflow prevention and inhibition of seizures coming from laser processing residues. A semiconductor device can include a semiconductor chip, a plurality of insulating substrates on each of which the semiconductor chip is fixed, a heat sink having a plurality of first grooves surrounding each one of more than one predetermined arrangement area. The plurality of insulating substrates can be arranged at each of the predetermined areas, and a plurality of second grooves surrounding the first groove, wherein the second grooves are shallower in depth than each of the first grooves, and solder filled between the insulating substrate and the arrangement area on the heat sink.