Invention Grant
- Patent Title: Interlayer light wave coupling device
- Patent Title (中): 中间层光波耦合装置
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Application No.: US14345346Application Date: 2013-10-04
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Publication No.: US09435946B2Publication Date: 2016-09-06
- Inventor: Youichi Sakakibara , Ryohei Takei , Masahiko Mori , Toshihiro Kamei
- Applicant: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Applicant Address: JP
- Assignee: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Current Assignee: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Current Assignee Address: JP
- Agency: Hayes Soloway P.C.
- Priority: JP2013-152430 20130723
- International Application: PCT/JP2013/077037 WO 20131004
- International Announcement: WO2015/011845 WO 20150129
- Main IPC: G02B6/26
- IPC: G02B6/26 ; G02B6/12 ; G02B6/122

Abstract:
An interlayer light wave coupling device includes a substrate; a first core disposed on the substrate and having a first acute structure; a third core spatially set apart from the first core and having a second acute structure; and a second core disposed between the first core and the third core and having a smaller index of refraction than the first core and the third core. The acute structures of the first core and the third core are disposed so as to have no overlap as viewed from above.
Public/Granted literature
- US20160139334A1 INTERLAYER LIGHT WAVE COUPLING DEVICE Public/Granted day:2016-05-19
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