Invention Grant
- Patent Title: Circuit and method for detection of IC connection failure
- Patent Title (中): 检测IC连接故障的电路和方法
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Application No.: US14472179Application Date: 2014-08-28
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Publication No.: US09435842B2Publication Date: 2016-09-06
- Inventor: Cicero Silveira Vaucher , Mingda Huang , Antonius de Graauw
- Applicant: NXP B.V.
- Applicant Address: NL Eindhoven
- Assignee: NXP B.V.
- Current Assignee: NXP B.V.
- Current Assignee Address: NL Eindhoven
- Agent Rajeev Madnawat
- Priority: EP13189631 20131022
- Main IPC: G01R31/04
- IPC: G01R31/04 ; G01R31/02 ; G01R31/28 ; G01R31/00

Abstract:
The invention provides a testing circuit for testing a connection between a chip and external circuitry. A current source is used to inject a DC current towards the connection to be tested from the chip side. On-chip ESD protection is provided giving a path between the connection to be tested and a fixed voltage line. A shunt path is also coupled to the connection to be tested on the external circuitry side. It is determined if the current source current flows through the ESD protection circuit, and this can be used to determine whether or not the connection to be tested presents an open circuit for the DC test current.
Public/Granted literature
- US20150108996A1 CIRCUIT AND METHOD FOR DETECTION OF IC CONNECTION FAILURE Public/Granted day:2015-04-23
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