Invention Grant
- Patent Title: Part holding head assembly for chip mounting device
- Patent Title (中): 用于芯片安装装置的零件保持头组件
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Application No.: US14874692Application Date: 2015-10-05
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Publication No.: US09435685B2Publication Date: 2016-09-06
- Inventor: Masaki Noriyuki , Takuya Tsutsumi , Tanijaki Masahiro , Susumu Kitada , Osamu Sugio , Hidemasa Koreeda , Tetsuo Fujihara
- Applicant: Hanwha Techwin Co., Ltd.
- Applicant Address: KR Changwon-Si
- Assignee: Hanwha Techwin Co., Ltd.
- Current Assignee: Hanwha Techwin Co., Ltd.
- Current Assignee Address: KR Changwon-Si
- Agency: Sughrue Mion, PLLC
- Priority: JP2014-205016 20141003; JP2014-205017 20141003
- Main IPC: B25J15/06
- IPC: B25J15/06 ; G01J1/04 ; G01D5/30 ; H05K13/04 ; H05K13/08

Abstract:
There is provided a part holding head assembly of a part mounting device including: a rotary head; a spindle configured to rotate in a first direction T with respect to a central axis of the spindle and configured to move in a second direction Z substantially parallel with an extending direction of the central axis of the spindle; a nozzle provided at a first end of the spindle; a raising part configured to move the spindle to in the second direction Z; and a contact detecting sensor configured to sense the nozzle contacting a part or the part held by the nozzle contacting a substrate and configured to generate a contact sensing signal according to the sensing.
Public/Granted literature
- US20160096277A1 PART HOLDING HEAD ASSEMBLY FOR CHIP MOUNTING DEVICE Public/Granted day:2016-04-07
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