Invention Grant
- Patent Title: Fan module
- Patent Title (中): 风扇模块
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Application No.: US14246954Application Date: 2014-04-07
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Publication No.: US09435351B2Publication Date: 2016-09-06
- Inventor: Yu-Huan Lin , Yi-Chun Shih
- Applicant: Inventec (Pudong) Technology Corporation , INVENTEC CORPORATION
- Applicant Address: CN Shanghai TW Taipei
- Assignee: INVENTEC (PUDONG) TECHNOLOGY CORPORATION,INVENTEC CORPORATION
- Current Assignee: INVENTEC (PUDONG) TECHNOLOGY CORPORATION,INVENTEC CORPORATION
- Current Assignee Address: CN Shanghai TW Taipei
- Agency: Maschoff Brennan
- Priority: CN201310608698 20131125
- Main IPC: F04D29/52
- IPC: F04D29/52 ; F04D25/06 ; F04D19/00 ; F04D29/60

Abstract:
A fan module, applied to a server including a first joint portion, includes a fan body, a first metal casing, a second metal casing and a plastic handle. The fan body includes an outlet surface, an inlet surface opposite to the outer surface, a first lateral surface and a second lateral surface. The first and second lateral surfaces are located between the outlet surface and the inlet surface. The first metal casing includes an air-through wall located on the outlet surface or the inlet surface, a first lateral wall connected to the air-through wall and mounted on the first lateral surface, and a metal handle connected to the first lateral wall. The second metal casing includes a second lateral wall mounted on the second lateral surface. The plastic handle, mounted on the second lateral wall, includes a second joint portion, for being engaged with the first joint portion.
Public/Granted literature
- US20150147166A1 FAN MODULE Public/Granted day:2015-05-28
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