Invention Grant
- Patent Title: High speed method for plating palladium and palladium alloys
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Application No.: US13924553Application Date: 2013-06-22
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Publication No.: US09435046B2Publication Date: 2016-09-06
- Inventor: Wan Zhang-Beglinger , Margit Clauss , Jonas Guebey , Felix J. Schwager
- Applicant: Rohm and Haas Electronic Materials LLC
- Assignee: Rohm and Haas Electronics LLC
- Current Assignee: Rohm and Haas Electronics LLC
- Agent John J. Piskorski
- Main IPC: C25D3/56
- IPC: C25D3/56 ; C25D3/52
Abstract:
A high speed method of depositing palladium and palladium alloys is disclosed. The high speed method uses an aqueous, ammonia-based bath which has reduced free ammonia in the bath. The high speed method may be used to deposit palladium and palladium alloy coatings on various substrates such as electrical devices and jewelry.
Public/Granted literature
- US20130284605A1 HIGH SPEED METHOD FOR PLATING PALLADIUM AND PALLADIUM ALLOYS Public/Granted day:2013-10-31
Information query
