Invention Grant
- Patent Title: Peeling device
- Patent Title (中): 剥皮装置
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Application No.: US14496708Application Date: 2014-09-25
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Publication No.: US09434497B2Publication Date: 2016-09-06
- Inventor: Bing Li , Bo Yang
- Applicant: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD. , HON HAI PRECISION INDUSTRY CO., LTD.
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: HONG FU JIN PRECISION (Shenzhen) CO., LTD.,HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: HONG FU JIN PRECISION (Shenzhen) CO., LTD.,HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agent Zhigang Ma
- Priority: CN201310619339 20131129
- Main IPC: B32B38/10
- IPC: B32B38/10 ; B65C9/08 ; B65C9/00 ; B32B43/00

Abstract:
A label peeling device includes a mounting bracket, a power member attached to the mounting bracket, a driving member driven by the power member; and a pressing assembly coupled to a first end of the driving member. A clamping mechanism includes a sliding member coupled to a second end of the driving member, and a clamping assembly configured to clamp a backing paper. A first resisting member is attached to the mounting bracket, and presses against the clamping assembly. The pressing assembly and the clamping mechanism are configured to be urged toward each other by a driving force imparted by the power member, the first resisting member drive the clamping assembly to the sliding member, and thereby cause at least one of the plurality of wafers to be removed from the backing paper.
Public/Granted literature
- US20150151530A1 PEELING DEVICE Public/Granted day:2015-06-04
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