A packaging device includes a conveyance mechanism, a guide portion, a heating portion, and a processor. The conveyance mechanism is configured to convey, in a conveyance direction along a conveyance path, a base on which an object is placed. The guide portion is configured to guide a film for packaging and to move along a movement path. The heating portion is provided below the conveyance path, is configured to heat the film, and includes a plurality of heating units that are arranged parallel to the conveyance path and that are arranged side by side in a direction intersecting the conveyance direction. Each of the plurality of heating units includes a heater and an urging portion. The urging portion is configured to urge the heater upward toward the conveyance path. The processor is configured to cause the heating portion to heat the film guided to a lower side of the base.