Invention Grant
- Patent Title: Apparatus and method for distressing an edge of a material
- Patent Title (中): 用于挫伤材料边缘的装置和方法
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Application No.: US13442960Application Date: 2012-04-10
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Publication No.: US09434087B2Publication Date: 2016-09-06
- Inventor: Brian W. Beakler , Matthew S. Myers , Kenneth O. Beck , Dave M. Warholic
- Applicant: Brian W. Beakler , Matthew S. Myers , Kenneth O. Beck , Dave M. Warholic
- Applicant Address: US PA Lancaster
- Assignee: AFI Licensing LLC
- Current Assignee: AFI Licensing LLC
- Current Assignee Address: US PA Lancaster
- Main IPC: B27D5/00
- IPC: B27D5/00 ; B27G17/04 ; B26D3/02 ; B26D3/06
Abstract:
An apparatus including a support for supporting a material having at least one edge, an edge cutter head, and an edge cutter head support for supporting the edge cutter head. In response to the edge cutter head and the at least one edge of the material being brought into cutting contact and moved relative to each other, a resulting portion of the at least one edge of the material is distressed.
Public/Granted literature
- US20130263709A1 APPARATUS AND METHOD FOR DISTRESSING AN EDGE OF A MATERIAL Public/Granted day:2013-10-10
Information query
