Invention Grant
- Patent Title: Retainer ring
- Patent Title (中): 保持环
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Application No.: US13715694Application Date: 2012-12-14
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Publication No.: US09434047B2Publication Date: 2016-09-06
- Inventor: Kuo-Cheng Lien , Hsin-Hsien Lu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: B24B37/32
- IPC: B24B37/32 ; B24B41/06
Abstract:
A retainer ring for chemical-mechanical polishing or other processes includes an outside ring and an inside ring that is attached to the outside ring. The inside ring is softer than the outside ring in hardness.
Public/Granted literature
- US20140134929A1 Retainer Ring Public/Granted day:2014-05-15
Information query
