Invention Grant
- Patent Title: Polishing composition and polishing method using the same
- Patent Title (中): 抛光组合物和抛光方法使用相同
-
Application No.: US13923477Application Date: 2013-06-21
-
Publication No.: US09434046B2Publication Date: 2016-09-06
- Inventor: Mikikazu Shimizu , Tomohiko Akatsuka , Kazuya Sumita
- Applicant: Fujimi Incorporated
- Applicant Address: JP Kiyosu-shi
- Assignee: Fujimi Incorporated
- Current Assignee: Fujimi Incorporated
- Current Assignee Address: JP Kiyosu-shi
- Agency: Vidas, Arrett & Steinkraus
- Priority: JP2008-023227 20080201
- Main IPC: B24B37/04
- IPC: B24B37/04 ; C09G1/02 ; H01L21/321
Abstract:
The present invention provides a polishing composition that can be suitably used in polishing of polysilicon, and a polishing method using the polishing composition. The polishing composition contains a nitrogen-containing nonionic surfactant and abrasive grains and has a pH of 9 to 12. The content of the nitrogen-containing nonionic surfactant in the polishing composition is preferably 20 to 500 ppm. The abrasive grains contained in the polishing composition are preferably colloidal silica. The average primary particle diameter of the abrasive grains contained in the polishing composition is preferably 10 to 90 nm. The content of the abrasive grains in the polishing composition is preferably 1.0 to 5.0% by mass.
Public/Granted literature
- US20130288573A1 Polishing Composition and Polishing Method Using The Same Public/Granted day:2013-10-31
Information query
