Invention Grant
- Patent Title: Laser machining apparatus
- Patent Title (中): 激光加工设备
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Application No.: US14244391Application Date: 2014-04-03
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Publication No.: US09434023B2Publication Date: 2016-09-06
- Inventor: Taiki Sawabe , Wakana Onoe , Tomohiro Endo
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Disco Corporation
- Current Assignee: Disco Corporation
- Current Assignee Address: JP Tokyo
- Agency: Greer Burns & Crain Ltd.
- Priority: JP2013-079640 20130405
- Main IPC: G01B11/00
- IPC: G01B11/00 ; H01L21/68 ; B23K26/04 ; B23K26/042 ; B23K26/359 ; B23K26/03

Abstract:
A laser machining apparatus that includes an interferometric height position detection unit, a condensing point position adjustment unit, and a confocal optical height position detection unit. A controller of the laser machining apparatus specifies, as a correction value, the difference between the two height positions of the upper face of the workpiece, one detected by the confocal optical height position detection unit and the other detected by the interferometric height position detection unit. The controller controls the condensing point position adjustment unit based on the height position obtained by correcting the height position of the upper face of the workpiece detected by the interferometric height position detection unit using the correction value.
Public/Granted literature
- US20140299586A1 LASER MACHINING APPARATUS Public/Granted day:2014-10-09
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