Invention Grant
- Patent Title: Pb-free copper-alloy sliding material, and plain bearing
- Patent Title (中): 无铅铜合金滑动材料和滑动轴承
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Application No.: US13493617Application Date: 2012-06-11
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Publication No.: US09434005B2Publication Date: 2016-09-06
- Inventor: Hiromi Yokota , Ryo Mukai , Shinichi Kato , Nahomi Hamaguchi
- Applicant: Hiromi Yokota , Ryo Mukai , Shinichi Kato , Nahomi Hamaguchi
- Applicant Address: JP Toyota-Shi
- Assignee: Taiho Kogyo Co., Ltd.
- Current Assignee: Taiho Kogyo Co., Ltd.
- Current Assignee Address: JP Toyota-Shi
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2007-129615 20070515
- Main IPC: B22F7/08
- IPC: B22F7/08 ; C22C1/04 ; C22C9/00 ; C22C9/02 ; F16C33/12 ; C22C9/04 ; C22C9/08
Abstract:
A method of producing a Pb-free copper-alloy sliding material containing 1.0 to 15.0% of Sn, 0.5 to 15.0% of Bi and 0.05 to 5.0% of Ag, and Ag and Bi from an Ag—Bi eutectic. If necessary, at least one of 0.1 to 5.0% of Ni, 0.02 to 0.2% P, 0.5 to 30.0% of Zn, and 1.0 to 10.0 mass % of at least one of a group consisting of Fe3P, Fe2P, FeB, NiB and AlN may be added.
Public/Granted literature
- US20120251375A1 PB-FREE COPPER-ALLOY SLIDING MATERIAL, AND PLAIN BEARING Public/Granted day:2012-10-04
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