Invention Grant
- Patent Title: Integrated wire carrier for electrode array
- Patent Title (中): 电极阵列集成线载体
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Application No.: US14178129Application Date: 2014-02-11
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Publication No.: US09433776B2Publication Date: 2016-09-06
- Inventor: Timothy Beerling , Chuladatta Thenuwara
- Applicant: Advanced Bionics LLC
- Applicant Address: US CA Valencia
- Assignee: ADVANCED BIONICS LLC
- Current Assignee: ADVANCED BIONICS LLC
- Current Assignee Address: US CA Valencia
- Agent Fabian Vancott; Steven Nichols
- Main IPC: H01R43/04
- IPC: H01R43/04 ; A61N1/05 ; A61F11/00

Abstract:
A method for forming a cochlear electrode array with a plurality of electrodes which are spaced so as to stimulate sites within a cochlea includes shaping a sheet of electrically conductive material to form a support structure and a plurality of electrodes, in which the electrodes are tethered to the support structure at the spacing of the cochlear electrode array. A cochlear lead includes a flexible body that has frictional characteristics that vary about its circumference. A cochlear lead includes a flexible body with a first region and a second region with different surface textures. This generates differential sliding forces during insertion of the cochlear lead which influence a motion of the cochlear lead during insertion. The cochlear lead having an electrode array with varying stiffness along its length is also provided.
Public/Granted literature
- US20140163662A1 INTEGRATED WIRE CARRIER FOR ELECTRODE ARRAY Public/Granted day:2014-06-12
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