Invention Grant
- Patent Title: Electrode device used in iontophoresis treatment
- Patent Title (中): 用于离子电渗疗法的电极装置
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Application No.: US13518343Application Date: 2010-12-17
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Publication No.: US09433772B2Publication Date: 2016-09-06
- Inventor: Akihiro Hasui
- Applicant: Akihiro Hasui
- Applicant Address: JP Higashikagawa-Shi
- Assignee: TEIKOKU SEIYAKU CO., LTD.
- Current Assignee: TEIKOKU SEIYAKU CO., LTD.
- Current Assignee Address: JP Higashikagawa-Shi
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2009-290943 20091222
- International Application: PCT/JP2010/072744 WO 20101217
- International Announcement: WO2011/078071 WO 20110630
- Main IPC: A61N1/30
- IPC: A61N1/30 ; A61N1/04

Abstract:
The present invention provides an electrode device used in iontophoresis treatment, in which an electrode layer used for introduction of medication can be contacted to a medication reservoir layer with a simple manner, and in which the medication reservoir layer can be reliably held when the medication is introduced into a skin. A main-electrode layer 3 and a sub-electrode layer 1 are secured on a substrate 6 while both the layers are being insulated from each other. The main-electrode layer 3 is intended for introduction of the medication, and the sub-electrode layer 1 is provided to hold the medication reservoir layer 5 on the substrate 6. The medication reservoir layer 5 is located on the substrate 6, so as to be in contact with the main-electrode layer 3 and the sub-electrode layer 1. The medication reservoir layer 5 is a gel containing halogen compound, and the sub-electrode layer 1 comprises a metal having a lower ionization tendency than hydrogen. The medication reservoir layer 5 and the sub-electrode layer 1 are bonded to each other by applying an electric current to both layers. In this way, the medication reservoir layer 5 can be firmly held on the substrate 6, while being kept in contact with the main-electrode layer 3.
Public/Granted literature
- US20120330217A1 ELECTRODE DEVICE USED IN IONTOPHORESIS TREATMENT Public/Granted day:2012-12-27
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