Invention Grant
- Patent Title: Incontinence implant assembly
- Patent Title (中): 失禁植入组件
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Application No.: US14195596Application Date: 2014-03-03
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Publication No.: US09433486B2Publication Date: 2016-09-06
- Inventor: Michael S. H. Chu
- Applicant: Boston Scientific Scimed, Inc.
- Applicant Address: US MN Maple Grove
- Assignee: Boston Scientific Scimed, Inc.
- Current Assignee: Boston Scientific Scimed, Inc.
- Current Assignee Address: US MN Maple Grove
- Agency: Brake Hughes Bellermann LLP
- Main IPC: A61F2/00
- IPC: A61F2/00 ; A61B17/06 ; A61B17/00

Abstract:
An implant assembly for treating incontinence in a patient may include an implant and an elongated member. The implant may include a first arm, a second arm, and a central portion, the first and second arms extending from the central portion. The elongated member may extend along the first arm. The elongated member may include a tail portion at a first end portion of the elongated member, the tail portion having a planar portion, at least part of the tail portion extending beyond the central portion of the implant in a direction opposite from a direction that the first arm extends from the central portion of the implant, an envelope portion, the envelope portion defining a lumen through which the first arm extends, and a window portion comprising a single planar portion extending from the envelope portion.
Public/Granted literature
- US20140257021A1 INCONTINENCE IMPLANT ASSEMBLY Public/Granted day:2014-09-11
Information query
IPC分类: