Invention Grant
US09414498B2 Via-hole drilling in a printed circuit board using a carbon monoxide laser 有权
在使用一氧化碳激光器的印刷电路板中进行通孔钻孔

Via-hole drilling in a printed circuit board using a carbon monoxide laser
Abstract:
Apparatus for drilling a via-hole in a printed circuit board (PCB) includes a carbon monoxide laser deliver laser radiation pulses. The pulses have a relatively broad wavelength-range, and slow rising and falling edges. The rising and falling edges of the pulses are clipped using and acousto-optic modulator. A dispersion-compensator compensates for dispersion in the clipped pulses introduced by the AOM. Achromatic focusing optics focus the dispersion-compensated, clipped pulses on the PCB for the via-hole drilling.
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