Invention Grant
US09414498B2 Via-hole drilling in a printed circuit board using a carbon monoxide laser
有权
在使用一氧化碳激光器的印刷电路板中进行通孔钻孔
- Patent Title: Via-hole drilling in a printed circuit board using a carbon monoxide laser
- Patent Title (中): 在使用一氧化碳激光器的印刷电路板中进行通孔钻孔
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Application No.: US14033246Application Date: 2013-09-20
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Publication No.: US09414498B2Publication Date: 2016-08-09
- Inventor: Gongxue Hua , Eric R. Mueller
- Applicant: Coherent, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Coherent, Inc.
- Current Assignee: Coherent, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Morrison & Foerster LLP
- Main IPC: B23K26/00
- IPC: B23K26/00 ; B23K26/16 ; H05K3/00 ; B23K26/38 ; B23K26/06 ; B23K26/40

Abstract:
Apparatus for drilling a via-hole in a printed circuit board (PCB) includes a carbon monoxide laser deliver laser radiation pulses. The pulses have a relatively broad wavelength-range, and slow rising and falling edges. The rising and falling edges of the pulses are clipped using and acousto-optic modulator. A dispersion-compensator compensates for dispersion in the clipped pulses introduced by the AOM. Achromatic focusing optics focus the dispersion-compensated, clipped pulses on the PCB for the via-hole drilling.
Public/Granted literature
- US20150083698A1 VIA-HOLE DRILLING IN A PRINTED CIRCUIT BOARD USING A CARBON MONOXIDE LASER Public/Granted day:2015-03-26
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