Invention Grant
- Patent Title: Wiring board, wiring board with lead, and electronic device
- Patent Title (中): 接线板，带导线的接线板和电子设备
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Application No.: US14758390Application Date: 2014-07-28
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Publication No.: US09414486B2Publication Date: 2016-08-09
- Inventor: Hidekazu Otomaru , Takashi Kimura
- Applicant: KYOCERA Corporation
- Applicant Address: JP Kyoto-Shi, Kyoto
- Assignee: KYOCERA CORPORATION
- Current Assignee: KYOCERA CORPORATION
- Current Assignee Address: JP Kyoto-Shi, Kyoto
- Agency: Volpe and Koenig, P.C.
- Priority: JP2013-156786 20130729; JP2013-195509 20130920
- International Application: PCT/JP2014/069809 WO 20140728
- International Announcement: WO2015/016173 WO 20150205
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H05K1/11 ; H01L23/498 ; H05K1/18 ; H01L23/15 ; H05K3/40 ; H05K3/34
Abstract:
A wiring board includes an insulating substrate composed of a ceramic sintered compact; and a connection pad disposed on a surface part of the insulating substrate. The connection pad includes a first portion disposed on the surface part of the insulating substrate and a second portion disposed on the first portion and an outer periphery of the second portion being located on an inner side of an outer periphery of the first portion. The second portion of the connection pad is composed of platinum, and at least an exposed surface part of the first portion of the connection pad is composed of platinum containing a ceramic component.
Public/Granted literature
- US20150334834A1 WIRING BOARD, WIRING BOARD WITH LEAD, AND ELECTRONIC DEVICE Public/Granted day:2015-11-19
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