Invention Grant
- Patent Title: Thermal expansion compensators for controlling microelectronic package warpage
- Patent Title (中): 用于控制微电子封装翘曲的热膨胀补偿器
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Application No.: US13992606Application Date: 2011-11-09
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Publication No.: US09414484B2Publication Date: 2016-08-09
- Inventor: Pramod Malatkar , Richard J. Harries
- Applicant: Pramod Malatkar , Richard J. Harries
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Winkle, PLLC
- International Application: PCT/US2011/059951 WO 20111109
- International Announcement: WO2013/070207 WO 20130516
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H05K1/02 ; H01L23/31 ; H01L23/00 ; H01L23/498
Abstract:
The present description relates to the field of fabricating microelectronic packages, wherein a microelectronic device may be attached to a microelectronic substrate with a compensator to control package warpage. The warpage compensator may be a low coefficient of thermal expansion material, including but not limited to silicon or a ceramic material, which is positioned on a land-side of the microelectronic device to counteract the thermal expansion effects of the microelectronic device.
Public/Granted literature
- US20130271929A1 THERMAL EXPANSION COMPENSATORS FOR CONTROLLING MICROELECTRONIC PACKAGE WARPAGE Public/Granted day:2013-10-17
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