Invention Grant
- Patent Title: LED module
- Patent Title (中): LED模块
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Application No.: US14133747Application Date: 2013-12-19
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Publication No.: US09414447B2Publication Date: 2016-08-09
- Inventor: Farhang Ghasemi Afshar , Krister Bergenek , Andreas Dobner , Holger Huebner , Meik Weckbecker , Ralph Wirth
- Applicant: OSRAM GmbH
- Applicant Address: DE Munich
- Assignee: OSRAM GmbH
- Current Assignee: OSRAM GmbH
- Current Assignee Address: DE Munich
- Agency: Viering, Jentschura & Partner mbB
- Priority: DE102013200129 20130108
- Main IPC: H01L33/52
- IPC: H01L33/52 ; H01L33/44 ; H01L23/522 ; F21V33/00 ; H05B33/08
Abstract:
In various embodiments, a light emitting diode module may include a carrier plate, at least one light emitting diode, and at least one sensor configured to register light emitted by the light emitting diode. The light emitting diode is attached to a light emitting diode installation side of the carrier plate. The sensor is installed countersunk through a hole of the carrier plate in relation to the light emitting diode installation side thereof.
Public/Granted literature
- US20140191255A1 LED MODULE Public/Granted day:2014-07-10
Information query
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