Invention Grant
- Patent Title: Method and apparatus for microwave treatment of dielectric films
- Patent Title (中): 电介质膜微波处理方法和装置
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Application No.: US14120013Application Date: 2014-04-15
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Publication No.: US09414445B2Publication Date: 2016-08-09
- Inventor: Iftikhar Ahmad , Mikhail Baklanov , Liping Zhang
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Moser Taboada
- Agent Alan Taboada
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H05B6/80 ; H01L21/02 ; H01L21/268 ; H01L21/67
Abstract:
A method for processing a dielectric film on a substrate comprises: depositing a porous dielectric film on a substrate; removing the porogen; stuffing the film with a protective polymeric material; performing at least one intermediate processing step on the stuffed dielectric film; placing the film in a microwave applicator cavity and heating to a first temperature to partially burn out the polymeric material; introducing a controlled amount of a polar solvent into the porosity created by the partial burn out; applying microwave energy to heat the film to a second selected temperature below the boiling point of the solvent to clean away remaining polymeric material; and applying microwave energy to heat the film to a third temperature above the boiling point of the solvent to completely burnout the residues of polymeric material. The interaction of the polar solvent with the microwaves enhances the efficiency of the cleaning process.
Public/Granted literature
- US20140322921A1 Method and apparatus for microwave treatment of dielectric films Public/Granted day:2014-10-30
Information query
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