Invention Grant
- Patent Title: Device-to-device (D2D) preamble design
- Patent Title (中): 设备到设备(D2D)前导码设计
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Application No.: US14140823Application Date: 2013-12-26
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Publication No.: US09414306B2Publication Date: 2016-08-09
- Inventor: Seunghee Han , Alexey Vladimirovich Khoryaev , Debdeep Chatterjee
- Applicant: Intel IP Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel IP Corporation
- Current Assignee: Intel IP Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H04W80/04
- IPC: H04W80/04 ; H04W88/06 ; H04W28/04 ; H04W72/04 ; H04W48/18 ; H04N7/14 ; H04W28/02 ; H04W52/02 ; H04W76/04 ; H04W8/00 ; H04L5/00 ; H04W88/02 ; H04W36/00 ; H04W60/00 ; H04L29/06 ; H04W8/22 ; H04J11/00 ; H04W24/06 ; H04W72/12 ; H04L12/801 ; H04W76/06 ; H04W48/06 ; H04W76/02

Abstract:
This application discusses, among other things, methods and apparatus for providing more efficient ways to enable D2D discovery and D2D communication simultaneously. In an example, a method can include assembling device-to device (D2D) discovery data at a wireless device, assembling D2D communication data at the wireless device, assembling a D2D preamble including the discovery data and the communication data, and transmitting the D2D preamble using a wireless transmitter of the wireless device.
Public/Granted literature
- US20140321360A1 DEVICE-TO-DEVICE (D2D) PREAMBLE DESIGN Public/Granted day:2014-10-30
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