Invention Grant
- Patent Title: Method of manufacturing HEMTs with an integrated Schottky diode
- Patent Title (中): 使用集成肖特基二极管制造HEMT的方法
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Application No.: US14492505Application Date: 2014-09-22
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Publication No.: US09412834B2Publication Date: 2016-08-09
- Inventor: Gerhard Prechtl , Clemens Ostermaier , Oliver Haeberlen
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/778 ; H01L29/872 ; H01L29/20 ; H01L21/283 ; H01L21/3205 ; H01L29/45

Abstract:
A method of manufacturing a transistor device includes forming a compound semiconductor material on a semiconductor carrier, forming a source region and a drain region spaced apart from each other in the compound semiconductor material with a channel region interposed between the source and drain regions, forming a Schottky diode integrated with the semiconductor carrier, and forming contacts extending from the source and drain regions through the compound semiconductor material and in electrical contact with the Schottky diode so that the Schottky diode is connected in parallel between the source and drain regions.
Public/Granted literature
- US20150011058A1 Method of Manufacturing HEMTs with an Integrated Schottky Diode Public/Granted day:2015-01-08
Information query
IPC分类: