Invention Grant
- Patent Title: Aligned gate-all-around structure
- Patent Title (中): 对齐门全面结构
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Application No.: US14683877Application Date: 2015-04-10
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Publication No.: US09412828B2Publication Date: 2016-08-09
- Inventor: Kuo-Cheng Ching , Jean-Pierre Colinge , Zhiqiang Wu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/423 ; H01L29/786 ; H01L29/40 ; H01L29/165 ; H01L29/66

Abstract:
A semiconductor device includes a gate disposed over a substrate. The gate has a first gate portion of the gate including a gate dielectric and a gate electrode disposed above a first channel region and a second gate portion including a gate dielectric and a gate electrode disposed between the substrate and the first channel region and aligned with the first gate portion. A source and a drain region are disposed adjacent the gate. A dielectric layer is disposed on the substrate and has a first portion underlying at least some of the source, a second portion underlying at least some of the drain; and a third portion underlying at least some of the first channel, the first gate portion and the second gate portion.
Public/Granted literature
- US20150214318A1 ALIGNED GATE-ALL-AROUND STRUCTURE Public/Granted day:2015-07-30
Information query
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