Invention Grant
- Patent Title: Electronic device
- Patent Title (中): 电子设备
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Application No.: US14793057Application Date: 2015-07-07
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Publication No.: US09412711B2Publication Date: 2016-08-09
- Inventor: Kenji Fujii , Satoshi Kageyama
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP2014-143164 20140711
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/00
Abstract:
The present invention provides an electronic device that is able to achieve an improvement in yield or an electronic device that is able to prevent a sealing resin from exfoliating from a sub-electrode. The electronic device is provided with an electronic element and a wire bonded to the electronic element. The electronic element includes a bonding pad to which the wire is bonded. The bonding pad includes a Pd layer that directly contacts the wire.
Public/Granted literature
- US20160013143A1 ELECTRONIC DEVICE Public/Granted day:2016-01-14
Information query
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