Invention Grant
US09412482B2 Cu-Ni-Co-Si based copper alloy sheet material and method for producing the same
有权
Cu-Ni-Co-Si系铜合金板材及其制造方法
- Patent Title: Cu-Ni-Co-Si based copper alloy sheet material and method for producing the same
- Patent Title (中): Cu-Ni-Co-Si系铜合金板材及其制造方法
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Application No.: US14068256Application Date: 2013-10-31
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Publication No.: US09412482B2Publication Date: 2016-08-09
- Inventor: Toshiya Kamada , Takashi Kimura , Weilin Gao , Fumiaki Sasaki , Akira Sugawara
- Applicant: DOWA METALTECH CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: DOWA METALTECH CO., LTD.
- Current Assignee: DOWA METALTECH CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Clark & Brody
- Priority: JP2012-239934 20121031
- Main IPC: C22C9/06
- IPC: C22C9/06 ; H01B1/02 ; C22F1/08

Abstract:
A Cu—Ni—Co—Si based copper alloy sheet material has second phase particles existing in a matrix, with a number density of ultrafine second phase particles is 1.0×109 number/mm2 or more. A number density of fine second phase particles is not more than 5.0×107 number/mm2. A number density of coarse second phase particles is 1.0×105 number/mm2 or more and not more than 1.0×106 number/mm2. The material has crystal orientation satisfying the following equation (1): I{200}/I0{200}≧3.0 (1) wherein I{200} represents an integrated intensity of an X-ray diffraction peak of the {200} crystal plane on the sheet material sheet surface; and I0{200} represents an integrated intensity of an X-ray diffraction peak of the {200} crystal plane in a pure copper standard powder sample.
Public/Granted literature
- US20140116583A1 Cu-Ni-Co-Si BASED COPPER ALLOY SHEET MATERIAL AND METHOD FOR PRODUCING THE SAME Public/Granted day:2014-05-01
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