Invention Grant
- Patent Title: Polybenzoxazole resin and precursor thereof
- Patent Title (中): 聚苯并恶唑树脂及其前体
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Application No.: US14000429Application Date: 2012-04-04
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Publication No.: US09410055B2Publication Date: 2016-08-09
- Inventor: Eiichi Honda
- Applicant: Eiichi Honda
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2011-086300 20110408
- International Application: PCT/JP2012/059242 WO 20120404
- International Announcement: WO2012/137840 WO 20121011
- Main IPC: C08G14/06
- IPC: C08G14/06 ; C09D161/00 ; C09D179/04 ; C08G73/22 ; H01B3/30

Abstract:
The present invention provides a polybenzoxazole resin containing a repeating unit represented by the following general formula (1): wherein R1 is a tetravalent aromatic group; N atoms and O atoms which are bonded to R1 are present in the form of pairs each consisting of an N atom and an O atom such that the N atom and the O atom in each pair are respectively bonded to adjacent two carbon atoms constituting the same aromatic ring in R1; R2 is an alkanediyl group having 1 to 6 carbon atoms; and n is an integer of 2 to 10000, which is excellent in electrical insulating properties, heat resistance, mechanical properties, physical properties, dimensional stability and the like, as well as a polybenzoxazole precursor capable of producing the polybenzoxazole resin which is excellent in solubility in solvents and storage stability.
Public/Granted literature
- US20130324662A1 POLYBENZOXAZOLE RESIN AND PRECURSOR THEREOF Public/Granted day:2013-12-05
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