A retaining device (1) for the form-fitting and/or force-fitting arrangement of two components (2, 3) to be connected in a bonded manner for a subsequent welding process. The retaining device (1) includes a cover (4), which can be pivoted about a pivot axis (5) and on the lower face of which a silicone layer (8) is arranged so as to face in the direction of the components (2, 3) to be connected, and a pressure plate (6) that can be moved in the direction of the cover (4) via at least one cylinder (7) and thus presses the components (2, 3) which are to be connected and which are arranged one above the other between the cover (4) and the pressure plate (6) against the silicone layer (8). A method for operating a retaining device (1) is also provided.