Invention Grant
- Patent Title: Multi-gate high voltage device
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Application No.: US14599942Application Date: 2015-01-19
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Publication No.: US09385707B2Publication Date: 2016-07-05
- Inventor: Jam-Wem Lee
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L29/02
- IPC: H01L29/02 ; H03K17/687 ; H01L29/78 ; H01L27/02 ; H01L27/088 ; H01L29/06

Abstract:
A high voltage semiconductor device, particularly a device including a number of high breakdown voltage transistors having a common drain, first well, and insulating structure between the gate and the drain as well as method for using the same is provided in this disclosure. The high breakdown voltage transistors in the device together are in an elliptical shape. A second well region, gate structure, and a source region are partially overlapping discontinuous elliptical rings having at least two discontinuities or openings in a top view. The respective discontinuities or openings define each of the high breakdown voltage transistors.
Public/Granted literature
- US20150130515A1 Multi-Gate High Voltage Device Public/Granted day:2015-05-14
Information query
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