Invention Grant
- Patent Title: Crimp machine and crimp system
- Patent Title (中): 压接机和压接系统
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Application No.: US14112736Application Date: 2012-04-17
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Publication No.: US09385498B2Publication Date: 2016-07-05
- Inventor: Shuuji Satake , Akiyoshi Kanazawa , Ken Ito , Yoshimitsu Maejima , Kazuya Tsubaki , Kazuhiro Kubota
- Applicant: Shuuji Satake , Akiyoshi Kanazawa , Ken Ito , Yoshimitsu Maejima , Kazuya Tsubaki , Kazuhiro Kubota
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Priority: JP2011-095943 20110422
- International Application: PCT/JP2012/060312 WO 20120417
- International Announcement: WO2012/144479 WO 20121026
- Main IPC: H01R43/042
- IPC: H01R43/042 ; H01R43/048 ; H04L29/12

Abstract:
Disclosed is a crimp machine capable of eliminating product management for a relay connector per an ID. In the crimp machine, by a power source line, a ground line, and a signal line being positioned between a terminal mount table to which a crimp connector disposed in the relay connector is mounted and a crimp blade, and by the crimp blade being move close to a terminal mount table, the power source line, the ground line, and the signal line are thus crimped, wherein a connection terminal is disposed on the terminal mount table and an ID is made to output from the connection terminal.
Public/Granted literature
- US20140053395A1 CRIMP MACHINE AND CRIMP SYSTEM Public/Granted day:2014-02-27
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