Invention Grant
US09385444B2 Lateral slide pick and place cover for reduced bent pins in LGA sockets
有权
在LGA插座中用于减少弯曲销的横向滑动拾取和放置盖
- Patent Title: Lateral slide pick and place cover for reduced bent pins in LGA sockets
- Patent Title (中): 在LGA插座中用于减少弯曲销的横向滑动拾取和放置盖
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Application No.: US14132924Application Date: 2013-12-18
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Publication No.: US09385444B2Publication Date: 2016-07-05
- Inventor: Vijaykumar Krithivasan , Gaurav Chawla , Joshua D. Heppner , Jeffory L. Smalley
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01R4/50
- IPC: H01R4/50 ; H01R13/447 ; H05K1/18 ; H01R12/71

Abstract:
An apparatus comprises a socket for an integrated circuited (IC), wherein the socket includes a socket body that includes a plurality of land grid array contacts for contacting the IC, an alignment mechanism, and a locking mechanism, and a cover for the socket, wherein the cover is vertically alignable with the alignment mechanism of the socket body and laterally slidable over the grid array contacts upon alignment to engage the locking mechanism of the socket body.
Public/Granted literature
- US20150171527A1 LATERAL SLIDE PICK AND PLACE COVER FOR REDUCED BENT PINS IN LGA SOCKETS Public/Granted day:2015-06-18
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