Invention Grant
- Patent Title: Integral grounding hub
- Patent Title (中): 集成接地集线器
-
Application No.: US14283003Application Date: 2014-05-20
-
Publication No.: US09385442B2Publication Date: 2016-07-05
- Inventor: Michael Charles Brown
- Applicant: Michael Charles Brown
- Applicant Address: US TX Houston
- Assignee: Cooper Technologies Company
- Current Assignee: Cooper Technologies Company
- Current Assignee Address: US TX Houston
- Agency: King & Spalding LLP
- Main IPC: H01R4/66
- IPC: H01R4/66 ; H01R4/36 ; H01R13/648 ; H01R4/34 ; H02G3/22 ; H01R4/64

Abstract:
The present disclosure provides systems and techniques for an improved grounding hub installation experience. The apparatus disclosure herein provides a plurality of quick access coupling points for connecting an integral grounding hub to a ground wire. Specifically, the disclosed apparatus includes one or more bosses having a top screw hole and a side screw hole and one or more recessed channels next to the screw holes. A ground wire can be received in the recessed channels and secured by a screw received in the respective screw hole. Additionally, some example embodiments include a through-hole formed beneath and orthogonal to the screw holes. The through-hole can receive a ground wire therethrough, which is pinned down by a screw received in the respective screw hole.
Public/Granted literature
- US20150340776A1 INTEGRAL GROUNDING HUB Public/Granted day:2015-11-26
Information query