Invention Grant
- Patent Title: Metamaterial structure
- Patent Title (中): 超材料结构
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Application No.: US13634746Application Date: 2011-03-18
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Publication No.: US09385428B2Publication Date: 2016-07-05
- Inventor: Hiroshi Toyao , Noriaki Ando
- Applicant: Hiroshi Toyao , Noriaki Ando
- Applicant Address: JP Tokyo
- Assignee: NEC CORPORATION
- Current Assignee: NEC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Young & Thompson
- Priority: JP2010-065183 20100319
- International Application: PCT/JP2011/001614 WO 20110318
- International Announcement: WO2011/114746 WO 20110922
- Main IPC: H01P3/08
- IPC: H01P3/08 ; H01Q9/04 ; H01Q13/20 ; H01Q13/28 ; H01Q15/00

Abstract:
A second conductor (200) is opposite to a first conductor (100), and is repeatedly arranged. A plurality of vias (400) are provided to each of a plurality of second conductors (200), and provide an inductance component between the first conductor (100) and the second conductor (200). A third conductor (300) is connected to a first one of the second conductors (200) through a via (500), and is opposite to a second one of the second conductors (200) located next to the first one of the second conductors (200), to thereby form a transmission line between the first one of the second conductors and the second one of the second conductors (200). That is, the third conductor (300) functions as a stub together with the second one of the second conductors (200).
Public/Granted literature
- US20130002377A1 STRUCTURE Public/Granted day:2013-01-03
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