An electronic device includes a semiconductor memory. The semiconductor memory includes a plurality of first planes and a plurality of second planes which are disposed over a substrate and alternately stacked in a vertical direction over the substrate, where each of the first planes includes a plurality of first lines which extends in a first direction parallel to the substrate and each of the second planes includes a plurality of second lines which extends in a second direction parallel to the substrate and intersecting with the first direction, a plurality of variable resistance patterns which is interposed between each of the first planes and each of the second planes, each of the variable resistance patterns being disposed at a cross point between a first line and a corresponding second lines, and an air-gap which is disposed between neighboring variable resistance patterns.