Invention Grant
- Patent Title: Multi-layer electronic component and method for manufacturing the same
- Patent Title (中): 多层电子元件及其制造方法
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Application No.: US13914382Application Date: 2013-06-10
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Publication No.: US09385302B2Publication Date: 2016-07-05
- Inventor: Masahiro Sato
- Applicant: KYOCERA CORPORATION
- Applicant Address: JP Kyoto-shi
- Assignee: KYOCERA CORPORATION
- Current Assignee: KYOCERA CORPORATION
- Current Assignee Address: JP Kyoto-shi
- Agency: Volpe and Koenig, P.C.
- Priority: JP2005-343492 20051129; JP2006-292384 20061027
- Main IPC: H01L41/047
- IPC: H01L41/047 ; H01L41/277 ; H01L41/083 ; H01L41/187 ; H01L41/273

Abstract:
A multi-layer electronic component that can be repetitively operated under high voltage, high temperature and high humidity is provided. The multi-layer electronic component comprises a plurality of dielectric material layers made of a sintered material having perovskite structure that includes Pb; and a plurality of internal electrodes, the dielectric material layers and the internal electrodes being stacked alternately one on another, wherein lead compound that remains in the crystal grain boundaries of the dielectric material layers is controlled so that the number of grains of the lead compound not smaller than 0.01 μm are 2 or less per 100 μm2 on average.
Public/Granted literature
- US20130270969A1 Multi-Layer Electronic Component and Method for Manufacturing the Same Public/Granted day:2013-10-17
Information query
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