Invention Grant
- Patent Title: Diamond substrates for superconducting quantum circuits
- Patent Title (中): 用于超导量子电路的金刚石衬底
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Application No.: US14497817Application Date: 2014-09-26
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Publication No.: US09385294B2Publication Date: 2016-07-05
- Inventor: Chad T. Rigetti , Lafe Spietz
- Applicant: International Business Machines Corporation , Brooklyn Quantum Works
- Applicant Address: US NY Armonk US CO Denver
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION,BROOKLYN QUANTUM WORKS
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION,BROOKLYN QUANTUM WORKS
- Current Assignee Address: US NY Armonk US CO Denver
- Agency: Cantor Colburn LLP
- Agent Vazken Alexanian
- Main IPC: H01L39/22
- IPC: H01L39/22 ; H01L39/24 ; H01L39/02 ; H01L39/12 ; G06N99/00
Abstract:
A mechanism relates to a superconducting quantum system. A diamond substrate layer is included. A superconducting quantum device is disposed on the diamond substrate layer. The superconducting quantum device includes a superconducting quantum circuit formed on top a surface of the diamond substrate layer.
Public/Granted literature
- US20160093790A1 DIAMOND SUBSTRATES FOR SUPERCONDUCTING QUANTUM CIRCUITS Public/Granted day:2016-03-31
Information query
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