An assembly of at least one thermoelectric element capable of generating an electric current under the effect of a temperature gradient exerted between two of its sides, referred to as the contact sides, and an electrical connection means is disclosed. The assembly includes a first deformable element electrically connecting the electrical connection means to the thermoelectric element, the first element including a first side linked to the electrical connection means and a second side linked to the thermoelectric element, the first side being deformable independently from the second side and vice versa, the assembly including a second deformable element forming a heat bridge between the first and second sides of the first element. A thermoelectric module including such an assembly and a thermoelectric device including such a module are also disclosed.