Invention Grant
- Patent Title: Integrated circuit packaging system with surface treatment and method of manufacture thereof
- Patent Title (中): 具有表面处理的集成电路封装系统及其制造方法
-
Application No.: US14659905Application Date: 2015-03-17
-
Publication No.: US09385100B1Publication Date: 2016-07-05
- Inventor: Hun Teak Lee , YoungChul Kim , Hyunll Bae , HeeSoo Lee , HeeJo Chi
- Applicant: Hun Teak Lee , YoungChul Kim , Hyunll Bae , HeeSoo Lee , HeeJo Chi
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Pte. Ltd.
- Current Assignee: STATS ChipPAC Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Wong & Rees LLP
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L23/00 ; H01L21/56
Abstract:
An integrated circuit packaging system, and a method of manufacture thereof, includes: an embedded trace substrate having bonding sites and traces embedded in a base material, an insulation layer on the traces, the insulation layer having a top surface coplanar with the top surface of the base material; and an integrated circuit die connected to the bonding sites.
Information query
IPC分类:
